Test Kit Assembly And Testing Bench

production stage 1

Solder Paste Application

Solder paste application involves using a stencil to deposit paste onto a PCB's pads, allowing for the quick and precise placement of surface mount devices (SMDs)

production stage 2

Component Placement

Using magnifying microscope SMD parts are placed on bare PCB ready for reflow.

production stage 3

Solder Reflow

Using a reflow plate to heat the PCB and allow the solder paste to melt and reflow and bond the SMD parts to PCB. Once this procedure is complete , Boards are naturally cooled and visually checked to make sure components are reflow correctly and all joints are solid.

Testing and Packing Stage:

Once all is complete the finished kit is tested with bench power supply for 24 hours burn in test to make sure Kits power supply is fully working and there are no glitches.

Final product will be placed in anti static bag ready to be shipped.

Kits Revisions and updates

There are always improvements to existing kits, Note that the revision you might get when you order a assembled kit might be different to the ones in pictures. Kits designs are always improved and you will always get the latest revisions.